Packaging, Test and Reliability

Students will explore various packaging technologies, from wire bonding to advanced 3D integration, understanding their impact on device performance and cost. The course also delves into critical test methods, including electrical, functional, and environmental testing, essential for quality assurance. Emphasis is placed on reliability physics and statistical analysis techniques to predict and improve semiconductor product longevity. Practical applications and industry standards are integrated throughout the curriculum to prepare students for real-world challenges.

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Introduction to Semiconductor Packaging, Test, and Reliabilitylecture

02Material Science in Electronic Packaginglecture

03First-Level Interconnects: Wire Bonding and Flip-Chip Technologieslecture

04Advanced Packaging Technologies: Wafer-Level and System-in-Package (SiP)lecture

05Thermal Management in Semiconductor Packageslecture

06Electrical Characterization and Parametric Testinglecture

07Functional Testing and Test Program Developmentlecture

08Introduction to Reliability Physics and Failure Mechanismslecture

09Environmental Testing: Stress Testing and Accelerated Life Testinglecture

10Statistical Methods for Reliability Data Analysislecture

11Failure Analysis Techniques and Toolslecture

12Design for Testability (DFT) and Built-In Self-Test (B BIST)lecture

13Supply Chain and Quality Management Standards (e.g., JEDEC, IPC)lecture

14Future Trends in Packaging, Test Automation, and AI for Reliabilitylecture

Syllabus

The course runs for 14 weeks, with each week focusing on a specific topic through online lectures, readings, and virtual labs. Active participation in weekly discussion forums is mandatory, contributing to the overall grade. Assessments include quizzes, a midterm exam, a final project report on a packaging/reliability case study, and a final exam. Late submissions will incur penalties, and academic integrity is strictly enforced, with all work expected to be original. Students are encouraged to leverage online resources and instructor office hours for support and clarification.